IC Packaging Technology Expo 2012
Packaging trade fairs
Venue: Tokyo International Exhibition Center (Tokyo Big Sight)
Location: Tokyo , Japan
Date: 18-JAN-2012 TO 20-JAN-2012
Industry: Packaging trade shows
Fair Profile:
IC Packaging Technology Expo 2012 for Packaging from 18-JAN-2012 TO 20-JAN-2012 takes place in Tokyo , Japan. Organized by Reed Exhibitions Japan Limited.
ICP - IC PACKAGING TECHNOLOGY EXPO is the most significant exhibition specialised in IC Final Manufacturing, (assembly, test and packaging). ICP gathers all lines of equipment, materials, manufacturing & testing services for manufacturing of fast-developing ICs such as SIPs, WCSPs, BGAs, FCs, etc. And held together is the SUBCONTRACTOR ZONE featuring the World's TOP companies in IC design, assembly and testing services.
Fair Organizer:
Reed Exhibitions Japan Limited
Pls send mail to [email protected], For more information about IC Packaging Technology Expo 2012
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